To achieve mounting near power semiconductors and improve response speed

KOA's thermal sensor(chip type) lineup now includes WTP, platinum thin film thermal sensor for wire bonding. This product features a back-side metallization structure that allows mounting via soldering or sintering.
Surface electrode of WTP supports thick aluminum wire bonding with a maximum diameter of 300μmΦ.
The structure provides excellent dielectric strength voltage (AC2700Vrms when soaked in silicone oil) between the front and back surfaces, enabling mounting using the same process as bare power semiconductor chips, making it ideal for power modules temperature control.  AEC-Q200 qualified.

Applications:  Power module temperature control, high-precision temperature control for various sensors

Benefits of WTP: To improve thermal response, To iｍprove thermal runaway control performance, To reduce mounting costs, To reduce design costs

From KOA Web.